A new Report by Delvens, titled "2.5D & 3D Semiconductor Packaging Market” offers a comprehensive analysis of the industry, which comprises insights on the Global analysis. The report also includes competitor and regional analysis, and contemporary advancements in the market.

The global 2.5D & 3D Semiconductor Packaging Market size is projected to reach a CAGR of 17.7% from 2023-2030.

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The Prominent Players in the 2.5D & 3D Semiconductor Packaging Market are

·        Amkor Technology

·        ASE group

·        Siliconware Precision Industries Co., Ltd.

·        Jiangsu Changjiang Electronics Technology Co. Ltd.

·        SÜSS MicroTec AG.

·        International Business Machines Corporation (IBM)

·        Intel Corporation

·        Qualcomm Technologies, Inc.

·        STMicroelectronics

·        Taiwan Semiconductor Manufacturing Company and More

2.5D/3D are packing methodologies for including numerous IC inside the same package. In a 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer to achieve significantly high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for the shortest interconnect and smallest package footprint.

The growth of the market is attributed to the growing consumption of semiconductor devices across several industries. Additionally, increasing demand for compact, high-functionality electronic devices is also going to drive the market. Furthermore, the growing adoption of high-end computing, servers, and data centers is going to provide the market with new opportunities.

Recent Developments

February 2022 - Shanghai Micro Electronics Equipment Group (SMEE), a Shanghai-based company, announced that it had delivered China's first advanced 2.5D/3D chip packaging stepper, which matches the advanced products in the same category. SMEE, a state-controlled semiconductor equipment company, reported that the new product aims to satisfy the need for the packaging of super-large chips used in high-performance computing (HPC) and high-end AI computing.

November 2021 - South Korea's Samsung Electronics Co. unveiled a new chip packaging technology called H-Cube, which stacks high-performance chips in smaller sizes. The tech giant said that its latest 2.5D semiconductor chip packaging technology is available for clients in artificial intelligence (AI), data center, high-performance computing (HPC), and networking products that require high-performance, large-area packaging.

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Regional Analysis

Asia Pacific to Dominate the Market         

·        The increasing smartphone adoption rates have made Asia-Pacific one of the largest mobile markets in the world due to factors such as rising population, increasing disposable income, and growing urbanization.

·        Additionally, the region is projected to witness rapid growth due to the increased demand for miniaturized circuits and the presence of established semiconductor manufacturing companies, OEMs, and ODMs.

The 2.5D & 3D Semiconductor Packaging Market is segmented into various segments such as packaging technology, end user, and region:

On the basis of packaging technology

·        3D Wafer-Level Chip-Scale Packaging (WLCSP)

·        3D TSV

·        5D

On the basis of end-user

·        Consumer Electronics

·        Aerospace and Defense

·        Medical Devices

·        Communications and Telecom

·        Automotive

·        Others

On the basis of region

·        Asia Pacific

·        North America

·        Europe

·        South America

·        Middle East & Africa

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In addition to the market data for the 2.5D & 3D Semiconductor Packaging Market, Delvens offers client-centric reports customized according to the company’s specific demand and requirement.

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